TAMURA(田村)锡膏资料表
TAMURA锡膏品质稳定
没有锡球，短路，空焊，塞孔现象
爬锡高，残留物少，扩散率佳，焊点亮
使用客户：华硕，松下，NEC,SONY,TCL
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TAMURA锡膏特性表
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品牌
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合金组成(%)
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融点(℃)
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锡粉颗粒度(um)
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助焊液含量(%)
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RMA-1061A(M1)
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63Sn/37Pb
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183
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22~45
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9.5±0.3 wt
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RMA-010-FP
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63Sn/37Pb
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183
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22~45
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9.5±0.3 wt
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RMA-010-FPA
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63Sn/37Pb
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183
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22~45
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9.5±0.3 wt
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RMA-1045CZ(10%)
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63Sn/37Pb
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183
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22~45
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10.0±0.3 wt
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RMA-012-FP
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62.8Sn/0.4Ag/36.8Pb
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179~183
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22~45
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9.5±0.3 wt
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RMA-20-21L
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62.8Sn/0.4Ag/36.8Pb
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179~183
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20~38
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10.0
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RMA-020-FP
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62Sn/2Ag/36Pb
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179~183
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20~38
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9.5±0.3 wt
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TLF-204-19A
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96.5Sn/3.0Ag/0.5Cu
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216~220
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20~38
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12.0±0.3
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TLF-204-49
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96.5Sn/3.0Ag/0.5Cu
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216~220
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20~38
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11.7
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TLF-204-93K
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96.5Sn/3.0Ag/0.5Cu
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216~220
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20~41
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11.9
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TLF-204-111
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96.5Sn/3.0Ag/0.5Cu
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216~220
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20~36
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11.8
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SQ-20S-27（T2）
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62.8Sn/0.4Ag/36.8Pb
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179~183
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20~38
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9.5
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TLF-401-11
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96.5Sn/3.0Ag/0.5Cu
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216~220
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20~36
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11.9
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TLF-211-111（4）
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96.5Sn/3.0Ag/0.5Cu
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216~220
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20~36
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11.8
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诚达科技
